2022 Corporate Executive Leadership Program (CELP)
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The Corporate Executive Leadership Program (CELP) is an industry-agnostic professional development / mentoring / coaching program conceived by the Ascend Greater Washington Chapter Corporate Executive Initiative (CEI). CEI is a coalition of prominent Pan-Asian leaders and senior executives in the Greater Washington Area. This program is a unique, immersive learning experience that will combine approximately 32 hours of classroom instruction with informal mentoring over a three-month period..
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CELP Mission
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To increase representation of Pan-Asian Executives in the Greater Washington Area
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Equip rising aspiring executives with skills required to succeed at the Senior Executive level
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Promote thought leadership
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Build power network
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CELP Concept
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High touch, 3-month program
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Mentoring from Greater Washington Area Pan-Asian executives
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Practical “how tos", hands-on training, and exercises
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“Safe” environment to speak freely, exchange ideas, practice, and solicit feedback
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Program Overview
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Thursday, December 8, 2022
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Myths of Asian Leadership
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Taking Risks
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Hybrid Working Environment
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Friday, December 9, 2022
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Power of Networking
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Inclusive Leadership
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Power and Influence
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Friday, January 27, 2023
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Personal Brand
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Communicating Your Story
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Friday, February 14, 2023
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Business Case Development and Presentations
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Qualifications
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Candidates must be in senior leadership roles where the next step in their career is Partner, Principal, Managing Director, or equivalent senior-level executive in their organization.
Must have:
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10+ years experience
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Senior Executive potential
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Strong motivation and need for leadership coaching and development
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Commitment to complete program
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Sponsorship from Senior Executive
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Space is limited, so act now! Complete the CELP application below and email to pmo@ascendcei.org by October 11, 2022.
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Key dates:
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October 11: Applications due
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October 11 - October 28: Applicant review and applicant interview with CELP Team, if required
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November 1-2: Applicant decisions communicated
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November 4: Applicant Payments/Acceptances due
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Program Dates:
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December 8-9: Module 1
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January 27, 2023: Module 2
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February 24, 2023: Module 3
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View Formal Application Announcement
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Sponsored by:
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